JPH0136270Y2 - - Google Patents
Info
- Publication number
- JPH0136270Y2 JPH0136270Y2 JP5499085U JP5499085U JPH0136270Y2 JP H0136270 Y2 JPH0136270 Y2 JP H0136270Y2 JP 5499085 U JP5499085 U JP 5499085U JP 5499085 U JP5499085 U JP 5499085U JP H0136270 Y2 JPH0136270 Y2 JP H0136270Y2
- Authority
- JP
- Japan
- Prior art keywords
- relay
- ring
- relays
- prevention frame
- resonance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002265 prevention Effects 0.000 claims description 14
- 230000000694 effects Effects 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
Landscapes
- Patch Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5499085U JPH0136270Y2 (en]) | 1985-04-13 | 1985-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5499085U JPH0136270Y2 (en]) | 1985-04-13 | 1985-04-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61171147U JPS61171147U (en]) | 1986-10-23 |
| JPH0136270Y2 true JPH0136270Y2 (en]) | 1989-11-06 |
Family
ID=30577245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5499085U Expired JPH0136270Y2 (en]) | 1985-04-13 | 1985-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0136270Y2 (en]) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US7082345B2 (en) | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US7101799B2 (en) | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
-
1985
- 1985-04-13 JP JP5499085U patent/JPH0136270Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61171147U (en]) | 1986-10-23 |
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